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Semiconductor reliability testing method high and low temperature test chamber
Date: Feb 18,2024 Views: 62
Semiconductor reliability testing method high and low temperature test chamberSpecimen:
When multiple samples are subjected to high-temperature experiments in the same test chamber, it should be ensured that all samples are at the same ambient temperature and have the same installation conditions.
For heat dissipation samples, each test piece cannot affect other test pieces due to radiation heat dissipation, that is, the distance between the test pieces should be large enough, so that for a single test piece, the heat radiated to it by other heat dissipation test pieces will cause The temperature change is so small that it can be ignored.
For non-heat dissipation specimens, high or low temperature tests where the temperature remains constant, the spacing between specimens does not need to be required, because after the temperature is constant, the temperature of the specimen will remain consistent with the temperature in the temperature test chamber, and no heat exchange will occur. The spacing between pieces has no effect on the test.
Temperature change test specimens of non-heat dissipation specimens should be spaced apart to allow sufficient air flow between the specimens to accelerate the heat exchange between the specimens and the temperature test chamber, so that the specimens can reach the test temperature as soon as possible.
experiment method:
1. Temperature lower limit working test: The test sample is first powered on and runs the test program for initial testing. When the sample under test is not working, gradually lower the temperature in the box to 0°C. After the temperature stabilizes, power on and run the test program for 5 hours. The function and operation of the sample under test should be normal. After the test, wait until the temperature in the box Return to room temperature, take out the sample, and restore to normal atmospheric pressure for 2 hours.
Recommended inspection standards: The function and operation of the test sample should be normal, and there should be no obvious deviation in appearance.
2. Low-temperature storage test: Put the sample into a low-temperature box, lower the temperature of the box to -20°C, store the sample under test for 16 hours without working, take out the sample and return it to room temperature, then restore it for 2 hours, and power on to run the test program. After post-inspection, the function and operation of the tested sample should be normal and there should be no obvious deviation in appearance. In order to prevent frost and condensation on the test sample during the test, the test sample is allowed to be sealed with polyethylene film before testing. If necessary, a moisture absorber can be installed in the sealing sleeve.
3. The sample to be tested for the upper temperature limit working test is first tested for preliminary testing. Under the condition that the sample under test is not working, gradually increase the temperature of the box to 40°C. After the temperature stabilizes, power on and run the system diagnostic program for 5 hours. The function and operation of the sample under test should be normal. After the test, wait until the temperature of the box is stable. Return to room temperature, take out the sample, and restore to normal atmospheric pressure for 2 hours.
4. High-temperature storage test: Put the sample into a high-temperature box, raise the temperature of the box to 55°C, and store the sample under test for 16 hours without working. Take the sample out and return it to room temperature for 2 hours.
