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What are the requirements for the stress screening rapid temperature change test chamber?

Date: Jun 08,2022 Views: 227

The rapid temperature change test chamber is mainly used for environmental stress screening of electronic equipment. Environmental stress screening is also called ESS. Different standards have different requirements for environmental stress screening. Let's take a look at the requirements of different standards for stress screening tests.

 

1. MIL-STD-2164, GJB-1032-90 electronic product stress screening:

High temperature: working limit temperature

Low temperature: working limit temperature

Temperature change rate: 5/min

Number of cycles: 10~12

 

2. MIL-344A-4-16 Electronic Equipment Environment Stress Screening:

High temperature: 71

Low temperature: -54

Temperature change rate: 5/min

Number of cycles: 10

 

3. MIL-2164A-19 Electronic Equipment Environmental Stress Screening

High temperature: working limit temperature

Low temperature: working limit temperature

Temperature change rate: 10/min

Number of cycles: 10

 

4.NABMAT-9492 US Navy Manufacturing Screening

High temperature: 55

Low temperature: -53

Temperature change rate: 15/min

Number of cycles: 10

 

5.GJB/Z34-5.1.6 Quantitative environment of electronic products Stress screening

High temperature: 85

Low temperature: -55

Temperature change rate: 15/min

Number of cycles: 25

 

6.GJB/Z34-5.1.6 Quantitative environment of electronic products Stress screening

High temperature: 70

Low temperature: -55

Temperature change rate: 5/min

Number of cycles: 10

 

If you have any questions about the test or model selection of the rapid temperature change test chamber, you can visit the official website of "Huanyi Instrument" and contact our technical staff to answer it for you.




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