What are the requirements for the stress screening rapid temperature change test chamber?
The rapid temperature change test chamber is mainly used for environmental stress screening of electronic equipment. Environmental stress screening is also called ESS. Different standards have different requirements for environmental stress screening. Let's take a look at the requirements of different standards for stress screening tests.
1. MIL-STD-2164, GJB-1032-90 electronic product stress screening:
High temperature: working limit temperature
Low temperature: working limit temperature
Temperature change rate: 5℃/min
Number of cycles: 10~12
2. MIL-344A-4-16 Electronic Equipment Environment Stress Screening:
High temperature: 71℃
Low temperature: -54℃
Temperature change rate: 5℃/min
Number of cycles: 10
3. MIL-2164A-19 Electronic Equipment Environmental Stress Screening
High temperature: working limit temperature
Low temperature: working limit temperature
Temperature change rate: 10℃/min
Number of cycles: 10
4.NABMAT-9492 US Navy Manufacturing Screening
High temperature: 55℃
Low temperature: -53℃
Temperature change rate: 15℃/min
Number of cycles: 10
5.GJB/Z34-5.1.6 Quantitative environment of electronic products Stress screening
High temperature: 85℃
Low temperature: -55℃
Temperature change rate: 15℃/min
Number of cycles: ≥25
6.GJB/Z34-5.1.6 Quantitative environment of electronic products Stress screening
High temperature: 70℃
Low temperature: -55℃
Temperature change rate: 5℃/min
Number of cycles: ≥10
If you have any questions about the test or model selection of the rapid temperature change test chamber, you can visit the official website of "Huanyi Instrument" and contact our technical staff to answer it for you.
