Why use a rapid temperature rise and fall test chamber for surface mount electronic components?

The more complex the assembly of components, the more tests are required to verify reliability. Among them, environmental stress screening (ESS) is one of the test items. The test equipment used for environmental stress screening is a rapid temperature rise and fall test chamber.

Failures primarily due to insufficient performance or production processes during environmental stress screening (ESS) testing, aging testing, initial functional testing, or during initial use.

Why do surface mount electronic components need stress screening?

The screening process utilizes the stress generated by the environment to over-stress the "weak" components in the assembly to the point of failure, preventing these potential defects from appearing in field use and causing field failure. The environment that produces these stresses may or may not be related to the environmental conditions in which the product will be used.

In the event of a failure, components are detected and repaired, replaced, scrapped, or redesigned for future products. ESS must be performed without damaging "normal" components. ESS is not an accelerated reliability test.

Main equipment for environmental stress screening:

1. Rapid temperature rise and fall test chamber / rapid temperature change test chamber

2. Equipment model: HYQT series

3. Equipment brand: Huanyi Instrument

4. Selection of heating and cooling rate: 5℃/min, 10℃/min, 15℃/min

Why use a rapid heating and cooling test chamber for the environmental stress screening test of surface mount electronic components? , which is also required in IPC-9701A. If you have any questions about this, you can visit the official website of "Huanyi Instrument" and consult relevant technical personnel.